Three-dimensional finite element analysis for the loosening of bolted joint.
Application of the molecular dynamics and finite element method to semiconductor devices
RESEARCH DETAILS
We have been focusing on the research field of the strength and reliability evaluations of mechanical structures based on material mechanics. Present research covers multi-scale simulation for semiconductor material (combining finite element method, dislocation dynamics and molecular dynamics), finite element simulation for the design of mechanical structure including bolted joints. Those researches are applied to the fields of semiconductors, automobile, railroad vehicle through the collaborations with industries.